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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. unless otherwise noted, this document contains production data. tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 tps737xx-q1 1-a low-dropout regulator with reverse current protection 1 1 features 1 ? qualified for automotive applications ? aec-q100 qualified with the following results: ? device temperature grade 0: ? 40 c to 150 c ambient operating temperature range ? device hbm esd classification level 2 ? device cdm esd classification level c4a ? stable with 1- f or larger ceramic output capacitor ? input voltage range: 2.2 v to 5.5 v ? ultra-low dropout voltage: 130 mv (typical) at 1 a ? excellent load transient response, even with only 1- f output capacitor ? nmos topology delivers low reverse leakage current ? 1% initial accuracy ? 3% overall accuracy over line, load, and temperature ? less than 20-na (typical) quiescent current in shutdown mode ? thermal shutdown and current limit for fault protection ? available in multiple output voltage versions ? adjustable output: 1.2 v to 5.5 v ? custom outputs available using factory package-level programming 2 applications ? point of load regulation for dsps, fpgas, asics, and microprocessors ? post-regulation for switching supplies ? portable and battery-powered equipment 3 description the tps737xx-q1 family of linear low-dropout (ldo) voltage regulators uses an nmos pass element in a voltage-follower configuration. this topology is relatively insensitive to output capacitor value and esr, allowing a wide variety of load configurations. load transient response is excellent, even with a small 1- f ceramic output capacitor. the nmos topology also allows very low dropout. the tps737xx-q1 family uses an advanced bicmos process to yield high precision while delivering very low dropout voltages and low ground pin current. current consumption, when not enabled, is under 20 na and ideal for portable applications. these devices are protected by thermal shutdown and foldback current limit. device information (1) part number package body size (nom) tps73719-q1, tps73733-q1 vson (8) 3.00 mm 3.00 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. typical application circuit tps737xx gnd en in out v in v out on off copyright ? 2016, texas instruments incorporated productfolder sample &buy technical documents tools & software support &community
2 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 3 6 specifications ......................................................... 4 6.1 absolute maximum ratings ...................................... 4 6.2 esd ratings .............................................................. 4 6.3 recommended operating conditions ....................... 4 6.4 thermal information .................................................. 4 6.5 electrical characteristics ........................................... 5 6.6 typical characteristics .............................................. 6 7 detailed description ............................................ 11 7.1 overview ................................................................. 11 7.2 functional block diagrams ..................................... 11 7.3 feature description ................................................. 12 7.4 device functional modes ........................................ 13 8 application and implementation ........................ 14 8.1 application information ............................................ 14 8.2 typical application .................................................. 14 9 power supply recommendations ...................... 16 10 layout ................................................................... 16 10.1 layout guidelines ................................................. 16 10.2 layout example .................................................... 17 10.3 power dissipation ................................................. 17 11 device and documentation support ................. 17 11.1 documentation support ........................................ 17 11.2 related links ........................................................ 18 11.3 receiving notification of documentation updates 18 11.4 community resources .......................................... 18 11.5 trademarks ........................................................... 18 11.6 electrostatic discharge caution ............................ 18 11.7 glossary ................................................................ 18 12 mechanical, packaging, and orderable information ........................................................... 18 12.1 package mounting ................................................ 18 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from original (december 2008) to revision a page ? added device information table, pin configuration and functions section, specifications section, esd ratings table, recommended operating conditions table, thermal information table, detailed description section, application and implementation section, power supply recommendations section, layout section, device and documentation support section, and mechanical, packaging, and orderable information section ................................................................ 1 ? deleted ordering information table ; see poa at the end of the datasheet .......................................................................... 1
3 tps73719-q1 , tps73733-q1 www.ti.com sbvs123a ? december 2008 ? revised july 2016 product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated 5 pin configuration and functions drb package 8-pin vson top view pin functions pin i/o description name no. en 5 i driving the enable pin (en) high turns on the regulator. driving this pin low puts the regulator into shutdown mode. see enable pin and shutdown for more details. en must not be left floating and can be connected to in if not used. fb 3 i adjustable voltage version only. this is the input to the control loop error amplifier, and it is used to set the output voltage of the device. gnd 4, pad g ground in 8 i unregulated input supply nr 3 ? fixed voltage versions only. connecting an external capacitor to this pin bypasses noise generated by the internal bandgap, reducing output noise to very low levels. out 1 o regulator output. a 1- f or larger capacitor of any type is required for stability. nc 2, 6, 7 ? no internal connection not to scale pad 1 out 8 in 2 nc 7 nc 3 fb,nr 6 nc 4 gnd 5 en
4 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 specifications 6.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) min max unit input supply voltage ? 0.3 6 v enable voltage ? 0.3 6 v output voltage ? 0.3 5.5 v input voltage nr or fb pin ? 0.3 6 v peak output current internally limited output short-circuit duration indefinite junction temperature range, t j ? 55 150 c storage temperature, t stg ? 65 150 c (1) aec q100-002 indicates that hbm stressing shall be in accordance with the ansi/esda/jedec js-001 specification. 6.2 esd ratings value unit v (esd) electrostatic discharge human-body model (hbm), per aec q100-002 (1) 2000 v charged-device model (cdm), per aec q100-011 500 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min max unit v in input supply voltage 2.2 5.5 v i out output current 0 1 a t j operating junction temperature ? 40 125 c (1) for more information about traditional and new thermal metrics, see the semiconductor and ic package thermal metrics application report. 6.4 thermal information thermal metric (1) tps737xx-q1 unit drb (vson) 8 pins r ja junction-to-ambient thermal resistance 52.2 c/w r jc(top) junction-to-case (top) thermal resistance 59.4 c/w r jb junction-to-board thermal resistance 19.3 c/w jt junction-to-top characterization parameter 2 c/w jb junction-to-board characterization parameter 19.3 c/w r jc(bot) junction-to-case (bottom) thermal resistance 11.8 c/w
5 tps73719-q1 , tps73733-q1 www.ti.com sbvs123a ? december 2008 ? revised july 2016 product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated (1) minimum v in = v out + v do or 2.2 v, whichever is greater. (2) for v out(nom) < 1.6 v, when v in 1.6 v, the output locks to v in and may result in an overvoltage condition on the output. to avoid this situation, disable the device before powering down v in . (3) tps73701 is tested at v out = 1.2 v. (4) tolerance of external resistors not included in this specification. (5) v do is not measured for fixed output versions with v out(nom) < 2.3 v, because minimum v in = 2.2 v. (6) fixed-voltage versions only; see the reverse current section for more information. 6.5 electrical characteristics over operating temperature range (t j = ? 40 c to 125 c), v in = ( v out(nom) + 1 v ) (1) , i out = 10 ma, v en = 2.2 v, c out = 2.2 f (unless otherwise noted). typical values are at t j = 25 c. parameter test conditions min typ max unit v in input voltage range (1) (2) 2.2 5.5 v v fb internal reference (tps73701) t j = 25 c 1.192 1.2 1.216 v v out output voltage range (tps73701) (3) v fb 5.5 ? v do v accuracy (1) (4) nominal t j = 25 c ? 1 1 % 5.36 v < v in < 5.5 v, v out = 5.08 v, 10 ma < i out < 800 ma, ? 40 c < t j < 85 c, tps73701 ? 2 2 over v in , i out , and temperature v out + 0.5 v v in 5.5 v, 10 ma i out 1 a ? 3 0.5 3 v out % / v in line regulation (1) v out(nom) + 0.5 v v in 5.5 v 0.01 %/v v out % / i out load regulation 1 ma i out 1 a 0.002 %/ma 10 ma i out 1 a 0.0005 v do dropout voltage (5) (v in = v out(nom) ? 0.1 v) i out = 1 a 130 500 mv z o (do) output impedance in dropout 2.2 v v in v out + v do 0.25 ? i cl output current limit v out = 0.9 v out(nom) 1.05 1.6 2.2 a i sc short-circuit current v out = 0 v 450 ma i rev reverse leakage current (6) ( ? i in ) v en 0.5 v, 0 v v in v out 0.1 a i gnd gnd pin current i out = 10 ma (i q ) 400 a i out = 1 a 1300 i shdn shutdown current (i gnd ) v en 0.5 v, v out v in 5.5 v 20 na i fb fb pin current (tps73701) 0.1 0.6 a psrr power-supply rejection ratio (ripple rejection) f = 100 hz, i out = 1 a 58 db f = 10 khz, i out = 1 a 37 v n output noise voltage bw = 10 hz to 100 khz c out = 10 f 27 v out v rms t str startup time v out = 3 v, r l = 30 ? , c out = 1 f 600 s v en(hi) en pin high (enabled) 1.7 v in v v en(lo) en pin low (shutdown) 0 0.5 v i en(hi) en pin current (enabled) v en = 5.5 v 20 na t sd thermal shutdown temperature shutdown, temperature increasing 160 c reset, temperature decreasing 140 t j operating junction temperature ? 40 125 c
6 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated 6.6 typical characteristics t j = 25 c, v in = ( v out(nom) + 1 v ), i out = 10 ma, v en = 2.2 v, c out = 2.2 f (unless otherwise noted) figure 1. load regulation figure 2. line regulation figure 3. dropout voltage vs output current figure 4. dropout voltage vs temperature figure 5. output voltage histogram figure 6. dropout voltage drift histogram 200180 160 140 120 100 8060 40 20 0 v (mv) do - 50 - 25 0 25 50 75 100 150 temperature ( c) 125 0.50.4 0.3 0.2 0.1 0 - 0.1 - 0.2 - 0.3 - 0.4 - 0.5 change in v (%) out 0 100 200 300 400 500 600 700 800 900 1000 i (ma) out referred to i = 10ma out - 40 c +125 c +25 c 0.200.15 0.10 0.05 0 - 0.05 - 0.10 - 0.15 - 0.20 change in v (%) out 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 v v - (v) in out +125 c +25 c - 40 c referred to v = v + 1.0v at i = 10ma in out out 3025 20 15 10 50 percent of units (%) - 1.0 - 0.9 - 0.8 - 0.7 - 0.6 - 0.5 - 0.4 - 0.3 - 0.2 - 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 v error (%) out i = 10ma out 1816 14 12 10 86 4 2 0 percent of units (%) - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0 1020 30 40 50 60 70 80 90 100 worst case dv /dt (ppm/ c) out i = 10ma out 200180 160 140 120 100 8060 40 20 0 v (mv) do 0 100 200 300 400 500 600 700 800 900 1000 i (ma) out +125 c +25 c v = 2.5v out - 40 c
7 tps73719-q1 , tps73733-q1 www.ti.com sbvs123a ? december 2008 ? revised july 2016 product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated typical characteristics (continued) t j = 25 c, v in = ( v out(nom) + 1 v ), i out = 10 ma, v en = 2.2 v, c out = 2.2 f (unless otherwise noted) figure 7. ground pin current vs output current figure 8. ground pin current vs temperature figure 9. ground pin current in shutdown vs temperature figure 10. current limit vs v out (foldback) figure 11. current limit vs v in figure 12. current limit vs temperature 2.01.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 current limit (a) 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 v (v) in 2.01.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 current limit (a) - 50 - 25 0 25 50 75 100 125 temperature ( c) v = 1.2v out 1 0.1 0.01 i ( m a) gnd - 50 - 25 0 25 50 75 100 125 temperature ( c) v = 0.5v enable v = v + 0.5v in out 2.01.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 current limit (ma) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 v (v) out v = 3.3v out i cl i sc 25002000 1500 1000 500 0 i ( m a) gnd 0 200 400 600 800 1000 i (ma) out v = 5.0v in v = 3.3v in v = 2.2v in 30002500 2000 1500 1000 500 0 i ( a) m gnd - 50 - 25 0 25 50 75 100 125 temperature ( c) i = 1a out v = 5.0v in v = 3.3v in v = 2.2v in
8 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated typical characteristics (continued) t j = 25 c, v in = ( v out(nom) + 1 v ), i out = 10 ma, v en = 2.2 v, c out = 2.2 f (unless otherwise noted) figure 13. psrr (ripple rejection) vs frequency figure 14. psrr (ripple rejection) vs v in ? v out figure 15. noise spectral density figure 16. tps73701 rms noise voltage vs c fb figure 17. rms noise voltage vs c out figure 18. rms noise voltage vs c nr 1 0.1 0.01 e v/ m ? ( hz) n 10 100 1k 10k 100k frequency (hz) c = 1 f m out c = 10 f m out i = 150ma out 6055 50 45 40 35 30 25 20 v (rms) n c (f) fb 10p 100p 1n 10n v = 2.5v out c = 0 m f out r = 39.2k w 1 10hz < frequency < 100khz 10k 10 9080 70 60 50 40 30 20 10 0 ripple rejection (db) 100 1k 100k 1m 10m frequency (hz) i = 1ma out c = 1 m f out i = 1ma out c = any out i = 1ma out c = 10 m f out i = 100ma out c = any out i = 100ma out c = 10 m f out i = 100ma o c = 1 m f o 4035 30 25 20 15 10 50 psrr (db) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 v v - (v) in out frequency = 10khz c = 10 f v = 2.5v i = 100ma m out out out 60 50 40 30 20 10 0 v n (rms) c ( f) m out 0.1 1 10 v out = 5.0v v out = 3.3v v out = 1.5v c nr = 0.01 f m 10hz < frequency < 100khz 140 120 100 80 60 40 20 0 v n (rms) c nr (f) 1p 10p 100p 1n 10n v out = 5.0v v out = 3.3v v out = 1.5v c out = 0 f m 10hz < frequency < 100khz
9 tps73719-q1 , tps73733-q1 www.ti.com sbvs123a ? december 2008 ? revised july 2016 product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated typical characteristics (continued) t j = 25 c, v in = ( v out(nom) + 1 v ), i out = 10 ma, v en = 2.2 v, c out = 2.2 f (unless otherwise noted) figure 19. tps73733 load transient response figure 20. tps73733 line transient response figure 21. tps73701 turn-on response figure 22. tps73701 turn-off response figure 23. tps73701, v out = 3.3 v power-up and power-down figure 24. i enable vs temperature 65 4 3 2 1 0 -1-2 volts 50ms/div v in v out 10 1 0.1 0.01 i (na) enable - 50 - 25 0 25 50 75 100 125 temperature ( c) 100 s/div m 1v/div1v/div 2v 0v v out v en r = 20 w l c = 10 f m out r = 20 w l c = 1 f m out 100 s/div m 1v/div1v/div v out v en r = 20 w l c = 10 f m out 2v 0v r = 20 w l c = 1 f m out 10 s/div m 200mv/div v out i out c = 10nf nr c = 10 f out m 10ma 1a 10 s/div m 100mv/div v out v in c = 10nf nr c = 10 f out m 4.3v 5.3v
10 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated typical characteristics (continued) t j = 25 c, v in = ( v out(nom) + 1 v ), i out = 10 ma, v en = 2.2 v, c out = 2.2 f (unless otherwise noted) figure 25. tps73701 i fb vs temperature figure 26. tps73701 i fb vs temperature figure 27. tps73701 load transient, adjustable version figure 28. tps73701 line transient, adjustable version 5 s/div m 100mv/div v out v in 4.5v 3.5v c = 10 f m out v = 2.5v out c = 10nf fb 160 140 120 100 80 60 40 20 0 i fb (na) ? 50 ? 25 0 25 50 75 100 125 temperature ( c) 160140 120 100 8060 40 20 0 i (na) fb - 50 - 25 0 25 50 75 100 125 temperature ( c) 10 s/div m 100mv/div v out i out 250ma 10ma c = 10 f m out c = 10nf fb r = 39.2k w 1
11 tps73719-q1 , tps73733-q1 www.ti.com sbvs123a ? december 2008 ? revised july 2016 product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated 7 detailed description 7.1 overview the tps737xx-q1 belongs to a family of new generation ldo regulators that use an nmos pass transistor to achieve ultra-low-dropout performance, reverse current blockage, and freedom from output capacitor constraints. these features combined with an enable input make the tps737xx-q1 ideal for portable applications. this regulator family offers a wide selection of fixed output voltage versions and an adjustable output version. all versions have thermal and over-current protection, including foldback current limit. table 1. standard 1% resistor values for common output voltages v out r 1 r 2 1.2 v short open 1.5 v 23.2 k 95.3 k 1.8 v 28.k 56.2 k 2.5 v 39.2 k 36.5 k 2.8 v 44.2 k 33.2 k 3 v 46.4 k 33.2 k 3.3 v 52.3 k 30.1 k 7.2 functional block diagrams figure 29. fixed voltage version servo error amp ref 27 k w 8 k w current limit thermal protection bandgap nr out r 1 r 2 en gnd in r 1 + r 2 = 80 k w 4-mhz charge pump copyright ? 2016, texas instruments incorporated
12 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated functional block diagrams (continued) see table 1 for standard resistor values. figure 30. adjustable voltage version 7.3 feature description 7.3.1 output noise a precision bandgap reference is used to generate the internal reference voltage (v ref ). this reference is the dominant noise source within the tps737xx-q1 and it generates approximately 32 v rms (10 hz to 100 khz) at the reference output (nr). the regulator control loop adds gain to the reference noise with the same gain as the reference voltage, so that the noise voltage of the regulator is approximately given by equation 1 . (1) because the value of v ref is 1.2 v, this relationship reduces to: (2) for the case of no c nr . an internal 27-k ? resistor in series with the noise reduction pin (nr) forms a low-pass filter for the voltage reference when an external noise reduction capacitor (c nr ) is connected from nr to ground. the total noise in the 10-hz to 100-khz bandwidth is reduced by a factor of approximately 3.2 for c nr = 10 nf, giving the approximate relationship for c nr = 10 nf in equation 3 . (3) this noise reduction effect is shown in figure 18 . the tps737xx-q1 uses an internal charge pump to develop an internal supply voltage sufficient to drive the gate of the nmos pass element above v out . the charge pump generates approximately 250 v of switching noise at approximately 4 mhz, however, charge-pump noise contribution is negligible at the output of the regulator for most values of i out and c out . rms n rms out v v (v ) 8.5 v (v) v ? ? = ? ? ( ) ( ) rms n rms out v v v 27 v v v ? ? = ? ? ( ) 1 2 out n rms rms 2 ref r r v v 32 v 32 v r v + = = servo error amp ref current limit thermal protection bandgap out fb r 1 r 2 en gnd in 80 k w 8 k w 27 k w 4-mhz charge pump copyright ? 2016, texas instruments incorporated
13 tps73719-q1 , tps73733-q1 www.ti.com sbvs123a ? december 2008 ? revised july 2016 product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated feature description (continued) 7.3.2 internal current limit the tps737xx-q1 internal current limit helps protect the regulator during fault conditions. foldback current limit helps to protect the regulator from damage during output short-circuit conditions by reducing current limit when v out drops below 0.5 v. see figure 10 . 7.3.3 enable pin and shutdown the enable pin (en) is active high and is compatible with standard ttl-cmos levels. a v en below 0.5 v (maximum) turns the regulator off and drops the gnd pin current to approximately 10 na. when en is used to shutdown the regulator, all charge is removed from the pass transistor gate, and the output ramps back up to a regulated v out (see figure 21 ). when shutdown capability is not required, en can be connected to v in . however, the pass gate may not be discharged using this configuration, and the pass transistor may be left on (enhanced) for a significant time after v in is removed. this scenario can result in reverse current flow (if the in pin is low impedance) and faster ramp times upon power-up. in addition, for v in ramp times slower than a few milliseconds, the output may overshoot upon power-up. 7.3.4 reverse current the nmos pass element of the tps737xx-q1 provides inherent protection against current flow from the output of the regulator to the input when the gate of the pass device is pulled low. to ensure that all charge is removed from the gate of the pass element, the en pin must be driven low before the input voltage is removed. if this is not done, the pass element may be left on because of stored charge on the gate. after the en pin is driven low, no bias voltage is required on any pin for reverse current blocking. reverse current is specified as the current flowing out of the in pin because of voltage applied on the out pin. there is additional current flowing into the out pin as a result of the 80-k ? internal resistor divider to ground (see figure 29 and figure 30 ). for the tps73701, reverse current may flow when v fb is more than 1 v above v in . 7.3.5 thermal protection thermal protection disables the output when the junction temperature rises to approximately 160 c, allowing the device to cool. when the junction temperature cools to approximately 140 c, the output circuitry is again enabled. depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. this cycling limits the dissipation of the regulator, protecting it from damage due to overheating. any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. junction temperature must be limited to 125 c maximum for reliable operation. to estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. thermal protection must trigger at least 35 c above the maximum expected ambient condition of your application for good reliability. this produces a worst-case junction temperature of 125 c at the highest expected ambient temperature and worst-case load. the internal protection circuitry of the tps737xx-q1 is designed to protect against overload conditions. it was not intended to replace proper heatsinking. continuously running the tps737xx-q1 into thermal shutdown degrades device reliability. 7.4 device functional modes driving the en pin over 1.7 v turns on the regulator. driving the en below 0.5 v causes the regulator to enter shutdown mode. in shutdwon, the current consumption of the device is reduced to 20 na (typical).
14 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated 8 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 8.1 application information the tps737xx-q1 family of ldo regulators use an nmos pass transistor to achieve ultra-low-dropout performance, reverse current blockage, and freedom from output capacitor constraints. these features, combined with low noise and an enable input, make the tps737xx-q1 ideal for portable applications. 8.2 typical application figure 31. typical application circuit for fixed-voltage versions figure 32. typical application circuit for adjustable-voltage version 8.2.1 design requirements r 1 and r 2 can be calculated for any output voltage using the formula shown in figure 32 . sample resistor values for common output voltages are shown in table 1 . make the parallel combination of r 1 and r 2 approximately equal to 19 k ? for best accuracy. this 19 k ? , in addition to the internal 8-k ? resistor, presents the same impedance to the error amplifier as the 27-k ? bandgap reference output. this impedance helps compensate for leakages into the error amplifier terminals. the tps73701 adjustable version does not have the nr pin available. however, connecting a feedback capacitor (c fb ) from the output to the feedback pin (fb) reduces output noise and improves load transient performance. this capacitor must be limited to 0.1 f. tps737xx gnd en in out v in v out on off copyright ? 2016, texas instruments incorporated tps73701 gnd en fb in out v in v ou t v out = x 1.204 (r 1 + r 2 ) r 2 r 1 c fb r 2 optional input capacitor. may improve source impedance, noise, or psrr. optional output capacitor. may improve load transient, noise, or psrr. optional capacitor reduces output noise and improves transient response. off on copyright ? 2016, texas instruments incorporated
15 tps73719-q1 , tps73733-q1 www.ti.com sbvs123a ? december 2008 ? revised july 2016 product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated typical application (continued) 8.2.2 detailed design procedure 8.2.2.1 input and output capacitor requirements although an input capacitor is not required for stability, if input impedance is very low, it is good analog design practice to connect a 0.1- f to 1- f low equivalent series resistance (esr) capacitor across the input supply near the regulator. this capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. a higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated or the device is located several inches from the power source. the tps737xx-q1 requires a 1- f output capacitor for stability. it is designed to be stable for all available types and values of capacitors. in applications where multiple low esr capacitors are in parallel, ringing may occur when the product of c out and total esr drops below 50 n ? f. total esr includes all parasitic resistances, including capacitor esr and board, socket, and solder joint resistance. in most applications, the sum of capacitor esr and trace resistance meets this requirement. 8.2.2.2 dropout voltage the tps737xx-q1 uses an nmos pass transistor to achieve extremely low dropout. when (v in ? v out ) is less than the dropout voltage (v do ), the nmos pass device is in its linear region of operation and the input-to-output resistance is the r ds(on) of the nmos pass element. the tps737xx-q1 requires a larger voltage drop from v in to v out to avoid degraded transient response for large step changes in load current. the boundary of this transient dropout region is approximately twice the dc dropout. values of v in ? v out above this line ensure normal transient response. operating in the transient dropout region can cause an increase in recovery time. the time required to recover from a load transient is a function of the magnitude of the change in load current rate, the rate of change in load current, and the available headroom (v in to v out voltage drop). under worst-case conditions (full-scale instantaneous load change with (v in ? v out ) close to dc dropout levels), the tps737xx-q1 can take a couple of hundred microseconds to return to the specified regulation accuracy. 8.2.2.3 transient response the low open-loop output impedance provided by the nmos pass element in a voltage follower configuration allows operation without a 1- f output capacitor. as with any regulator, the addition of additional capacitance from the out pin to ground reduces undershoot magnitude but increases its duration. in the adjustable version, the addition of a capacitor (c fb ) between the out pin and the fb pin also improves the transient response. the tps737xx-q1 does not have active pulldown when the output is overvoltage. this architecture allows for applications that connect higher voltage sources, such as alternate power supplies, to be connected to the output. this architecture also results in an output overshoot of several percent if the load current quickly drops to zero when a capacitor is connected to the output. the duration of overshoot can be reduced by adding a load resistor. the overshoot decays at a rate determined by the output capacitor (c out ) and the internal and external load resistance. the rate of decay is given by equation 4 and equation 5 . (fixed voltage version) (4) (adjustable voltage version) (5) ( ) out out 1 2 load v dv dt c 80 k r r r = w + p p out out load v dv dt c 80 k r = w p
16 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated typical application (continued) 8.2.3 application curves figure 33. tps737xx-q1 start-up figure 34. tps737xx-q1 shutdown 9 power supply recommendations the device is designed to operate from an input voltage supply range from 2.2 v to 5.5 v. the input voltage range provides adequate headroom for the device to have a regulated output. this input supply must be well regulated. if the input supply is noisy, additional input capacitors with low esr help improve the output noise performance. 10 layout 10.1 layout guidelines 10.1.1 improve psrr and noise performance ti recommends that the printed circuit board (pcb) be designed with separate ground planes for v in and v out , with each ground plane connected only at the gnd pin of the device, to improve ac performance such as psrr, output noise, and transient response. in addition, the ground connection for the bypass capacitor must connect directly to the gnd pin of the device.
17 tps73719-q1 , tps73733-q1 www.ti.com sbvs123a ? december 2008 ? revised july 2016 product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated 10.2 layout example figure 35. layout diagram 10.3 power dissipation the ability to remove heat from the die is different for each package type, presenting different considerations in the pcb layout. the pcb area around the device that is free of other components moves the heat from the device to the ambient air. performance data for jedec low-k and high-k boards are shown in thermal information . using heavier copper increases the effectiveness in removing heat from the device. the addition of plated through-holes to heat-dissipating layers also improves the heatsink effectiveness. power dissipation depends on input voltage and load conditions. power dissipation (p d ) is equal to the product of the output current multiplied by the voltage drop across the output pass element (v in to v out ). see equation 6 . (6) power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required output voltage. 11 device and documentation support 11.1 documentation support 11.1.1 related documentation for related documentation see the following: solder pad recommendations for surface-mount devices (sbfa015) ( ) d in out out p v v i = - nr/fb en 1 3 4 8 6 5 gnd plane gnd plane cin cout nc vout vin tps737xx-q1 r 1 r 2 c ff copyright ? 2016, texas instruments incorporated
18 tps73719-q1 , tps73733-q1 sbvs123a ? december 2008 ? revised july 2016 www.ti.com product folder links: tps73719-q1 tps73733-q1 submit documentation feedback copyright ? 2008 ? 2016, texas instruments incorporated 11.2 related links the table below lists quick access links. categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. table 2. related links parts product folder sample & buy technical documents tools & software support & community tps73719-q1 click here click here click here click here click here tps73733-q1 click here click here click here click here click here 11.3 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 11.4 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 11.5 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 11.6 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 12 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. 12.1 package mounting see solder pad recommendations for surface-mount devices ( sbfa015 ) for tps737xx-q1 solder pad footprint recommendations.
package option addendum www.ti.com 26-apr-2016 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples tps73719qdrbrq1 active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr -40 to 125 719q TPS73733QDRBRQ1 active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr -40 to 125 733q (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 26-apr-2016 addendum-page 2 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant tps73719qdrbrq1 son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 TPS73733QDRBRQ1 son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 package materials information www.ti.com 27-apr-2016 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) tps73719qdrbrq1 son drb 8 3000 367.0 367.0 35.0 TPS73733QDRBRQ1 son drb 8 3000 367.0 367.0 35.0 package materials information www.ti.com 27-apr-2016 pack materials-page 2

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